Image sensing device

ABSTRACT

An image sensing device includes an image sensing chip, an optical module and a protecting element. The image sensing chip has a front surface defining an image sensing region thereon. The optical module includes a barrel and at least one transparent element. The barrel is directly disposed on the front surface and around the image sensing region. The transparent element is disposed in the barrel and faces to the image sensing region. The protecting element covers an area of the front surface outside the optical module and surrounds the barrel. The image sensing device has a thin thickness.

BACKGROUND

1. Field of the Invention

The present invention relates to a sensing device, and particularly toan image sensing device.

2. Description of the Related Art

FIG. 1 is a schematic, cross-sectional view of a conventional imagesensing device. FIG. 2 is a schematic view of a wafer including a numberof image sensing devices shown in FIG. 1. Referring to FIG. 1 and FIG.2, the image sensing device 100 sawed from the wafer 50 includes animage sensing chip 110, a spacer 120, a protecting glass 130 and a lensmodule 140. An image sensing region 112 is defined on a front surface111 of the image sensing chip 110. The image sensing region 112 includesa number of light sensitive units 114 arranged in an array. Color filterpatterns 116 are respectively disposed on the light sensitive units 114,and micro lenses 118 are respectively disposed on the color filterpatterns 116. Additionally, the spacer 120 is disposed on the frontsurface 111 of the image sensing chip 110 and around the image sensingregion 112. The spacer 120 is configured for supporting the protectingglass 130. The lens module 140 is disposed on the protecting glass 130.

In the conventional technique, the protecting glasses 130 over the wafer50 are a whole and the lens modules 140 over the wafer 50 are also awhole. In other words, the protecting glasses 130 are separated eachother by a sawing process of the wafer 50, and the lens modules 140 areseparated each other by the sawing process of the wafer 50. Thus, anorthogonal projection area of the lens module 140 on the front surface111 of the image sensing chip 110 is equal to the area of the frontsurface 111 of the image sensing chip 110.

The protecting glass 130 in the conventional image sensing device 100can support the lens module 140 and prevent the image sensing region 112from particles. However, the spacer 120 is needed to support theprotecting glass 130 in the conventional image sensing device 100. Theimage sensing device 100 will be thickened due to thickness of thespacer 120 and the thickness of the protecting glass 130. Furthermore, apoor flatness of the spacer 120 and a poor flatness of the protectingglass 130 will affect the transmission path of the light, therebyreducing the quality of the image sensing device 100. In addition, it isvery difficult for the protecting glass 130 to have a transparence of100%, thereby reducing a light utility efficiency of the image sensingdevice 100.

Therefore, what is needed is an image sensing device to overcome theabove disadvantages.

BRIEF SUMMARY

The present invention provides an image sensing device having a thinthickness.

To achieve the above-mentioned advantages, the present inventionprovides an image sensing device includes an image sensing chip, anoptical module and a protecting element. The image sensing chip has afront surface defining an image sensing region thereon. The opticalmodule includes a barrel and at least one transparent element. Thebarrel is directly disposed on the front surface and around the imagesensing region. The transparent element is disposed in the barrel andfaces to the image sensing region. The protecting element covers an areaof the front surface outside the optical module and surrounds thebarrel.

In one embodiment provided by the present invention, the protectingelement is composed of a molding compound. In detail, the protectingelement is composed of, for example, an epoxy molding compound. Inaddition, the barrel has a top surface, and the protecting elementextends, for example, to cover a portion of the top surface of thebarrel. Furthermore, the protecting element extends, for example, tocover a number of side walls of the image sensing chip.

In one embodiment provided by the present invention, the protectingelement is a guarding ring sleeved on the barrel. Material of theprotecting element includes, for example, metal, plastic or ceramic. Inaddition, the barrel has a top surface, and the protecting elementextends, for example, to cover a portion of the top surface of thebarrel. Moreover, the protecting element is adhered to the barrel andthe image sensing chip through an adhesive.

In one embodiment provided by the present invention, the barrel isadhered to the front surface through an adhesive.

In one embodiment provided by the present invention, an orthogonalprojection area of the optical module on the front surface is less thanan area of the front surface and is more than an area of the imagesensing region.

In one embodiment provided by the present invention, the image sensingregion includes a number of light sensitive units arranged in an arrayand a number of color filter patterns corresponding to the lightsensitive units, and the color filter patterns are respectively disposedon the light sensitive units.

In one embodiment provided by the present invention, the image sensingregion further includes a number of micro lenses corresponding to thecolor filter patterns, and the micro lenses are respectively disposed onthe color filter patterns.

In one embodiment provided by the present invention, the color filterpatterns include a number of red filter patterns, a number of greenfilter patterns and a number of blue filter patterns.

In one embodiment provided by the present invention, the image sensingchip is a front side illumination (FSI) complementary metal oxidesemiconductor (CMOS) image sensing chip.

In one embodiment provided by the present invention, the image sensingchip is a back side illumination (BSI) CMOS image sensing chip.

In one embodiment provided by the present invention, the image sensingdevice further includes a substrate, and the image sensing chip isdisposed on a supporting surface of the substrate and is electricallyconnected to the substrate.

In one embodiment provided by the present invention, the image sensingchip includes a number of through silicon vias (TSVs), and the imagesensing chip is electrically connected to the substrate through thethrough silicon vias.

In one embodiment provided by the present invention, the substrateincludes a number of electrically connecting portions disposed on a rearsurface opposite to the supporting surface.

In one embodiment provided by the present invention, the optical moduleis a lens module, and the transparent element includes at least a lens.

In the image sensing device of the present invention, the optical moduleis directly disposed on the front surface of the image sensing chip.Thus, the spacer and the protecting glass in the conventional imagesensing device can be omitted, thereby reducing the thickness of theimage sensing device.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features and advantages of the various embodimentsdisclosed herein will be better understood with respect to the followingdescription and drawings, in which like numbers refer to like partsthroughout, and in which:

FIG. 1 is a schematic, cross-sectional view of a conventional imagesensing device.

FIG. 2 is a schematic view of a wafer including a number of imagesensing devices shown in FIG. 1.

FIG. 3 is a schematic, cross-sectional view of an image sensing devicein accordance with an embodiment of the present invention.

FIG. 4 is a schematic, cross-sectional view of an image sensing devicein accordance with another embodiment of the present invention.

DETAILED DESCRIPTION

FIG. 3 is a schematic, cross-sectional view of an image sensing devicein accordance with another embodiment of the present invention.Referring to FIG. 3, in the present embodiment, an image sensing device200 includes an image sensing chip 210, an optical module 220 and aprotecting element 230. The image sensing chip 210 has a front surface211. The front surface 211 defines an image sensing region 212 thereon.The optical module 220 includes a barrel 222 and at least onetransparent element 224. The barrel 222 is directly disposed on thefront surface 211 and around the image sensing region 212. Thetransparent element 224 is disposed in the barrel 222 and faces to theimage sensing region 212. The protecting element 230 covers an area ofthe front surface 211 outside the optical module 220 and surrounds thebarrel 222.

The image sensing chip 210 can be, but not limited to, either a frontside illumination CMOS image sensing chip or a back side illuminationCMOS image sensing chip. In addition, the image sensing region 212includes a number of light sensitive units 214 arranged in an array anda number of color filter patterns 216 corresponding to the lightsensitive units 214. In other words, one of the color patterns 216corresponds to and is disposed on one of the light sensitive units 214.The color filter patterns 216 are respectively disposed on the lightsensitive units 214. The color filter patterns 216 include a number ofred filter patterns, a number of green filter patterns and a number ofblue filter patterns. Thus, the image sensing chip 210 can sense a colorimage. It is noted that the color filter patterns 216 are not limited bythe above mentioned colors. An arrangement of the color filter patterns216 is known by one skilled in the art and is not described here.Further, a number of micro lenses 218 corresponding to the color filterpatterns 216 can be disposed in the image sensing region 212 so as toimprove the light sensing efficiency of the light sensitive units 214.In other words, one of the micro lenses 218 corresponds to one of thecolor filter patterns 216. The micro lenses 218 are respectivelydisposed on the color filter patterns 216. Thus, one of the micro lenses218 can congregate the light to the corresponding light sensitive unit214, thereby improve the light sensing efficiency of the light sensitiveunits 214.

For example, the barrel 222 of the optical module 220 is adhered to thefront surface 211 of the image sensing chip 210 through an adhesive (notshown). An orthogonal projection area A1 of the optical module 220 onthe front surface 211 is less than an area A2 of the front surface 211and is more than an area A3 of the image sensing region 212. Inaddition, the transparent element 224 of the optical module 220 can beconfigured for preventing the image sensing region 212 from particles.The transparent element 224 can be a plane plate or include at least alens with a certain curvature. In other words, in an embodiment, theoptical module 220 can be a lens module. The transparent element 224(i.e., a lens) of the optical module 220 can be configured forcongregating the light so as to improve the light sensing efficiency ofthe light sensitive units 214.

In the present embodiment, the protecting element 230 is composed of amolding compound. In detail, for example, the protecting element 230 iscomposed of an epoxy molding compound. That is, the protecting element230 is formed in a package process. The protecting element 230 can beconfigured for protecting the image sensing chip 210 and firmly fixingthe optical module 220 on the front surface 211 of the image sensingchip 210. In addition, the barrel 222 has a top surface 223, and theprotecting element 230 can extend to cover a portion of the top surface223 of the barrel 222. Thus, an adhesion of the protecting element 230and the barrel 222 can be increased, thereby avoiding an interspacebetween the protecting element 230 and the barrel 222. Furthermore, theprotecting element 230 can extend to cover a number of side walls 213 ofthe image sensing chip 210. Thus, the image sensing chip 210 can beprotected entirely.

Further, the image sensing device 200 can include a substrate 240. Theimage sensing chip 210 is disposed on a supporting surface 242 of thesubstrate 240 and is electrically connected to the substrate 240.Additionally, the image sensing chip 210 can include a number of throughsilicon vias 215. The image sensing chip 210 is electrically connectedto the substrate 240 through the through silicon vias 215. It is notedthat the image sensing chip 210 can be electrically connected to thesubstrate 240 by using other suitable means. In addition, the substrate240 has a rear surface 244 opposite to the supporting surface 242. Anumber of electrically connecting portions 246 (e.g., solder balls) aredisposed on the rear surface 244. The image sensing device 200 can beelectrically connected to a print circuit board of an electronic product(e.g., a mobile telephone, a notebook, or a digital camera, etc.)through the electrically connecting portions 246.

In the present embodiment, the optical module 220 of the image sensingdevice 200 is directly disposed on the front surface 211 of the imagesensing chip 210. Thus, the spacer and the protecting glass used in theconventional image sensing device can be omitted. Comparative to theconventional image sensing device, the image sensing device 200 in thepresent embodiment has a thinner thickness, thereby reducing thethickness of the electronic product using the image sensing device 200.Additionally, because the spacer and the protecting glass used in theconventional image sensing device are omitted, the problem reducing thequality of the image sensing device and caused by a poor flatness of thespacer and a poor flatness of the protecting glass can be avoided.Furthermore, in the present embodiment, because the protecting glassused in the conventional image sensing device is omitted, the light lossdue to the protecting glass can be avoided, thereby increasing the lightutility efficiency of the image sensing device 200.

FIG. 4 is a schematic, cross-sectional view of an image sensing devicein accordance with another embodiment of the present invention.Referring to FIG. 4, the image sensing device 200′ in the presentembodiment is similar to the image sensing device 200 except theprotecting element. In detail, the protecting element 230′ of the imagesensing device 200′ in the present embodiment is, for example, apreformed guarding ring. That is, the protecting element 230′ is sleevedon the barrel 222 after the protecting element 230′ is formed. Theprotecting element 230′ can be combined with the barrel 222 in a mannerof tight fit. In an embodiment, the protecting element 230′ can beadhered to the barrel 222 and the image sensing chip 210 through anadhesive (not shown). Thus, the protecting element 230′ can be combinedtogether with the barrel 222 firmly and an interspace between theprotecting element 230′ and the front surface 211 of the image sensingchip 210 will be avoided.

Material of the protecting element 230′ includes, for example, metal,plastic, ceramic or other suitable material. The protecting element 230′can cover an area of the front surface 211 outside the optical module220 and surround the barrel 222. Also, the protecting element 230′ canbe designed to extend to cover a portion of the top surface 223 of thebarrel 222. In another embodiment, the protecting element 230 can bedesigned to extend to cover the side walls 213 of the image sensing chip210.

Advantages of the image sensing device 200′ in the present embodiment issimilar to the advantages of the image sensing device 200 and are notdescribed here.

The above description is given by way of example, and not limitation.Given the above disclosure, one skilled in the art could devisevariations that are within the scope and spirit of the inventiondisclosed herein, including configurations ways of the recessed portionsand materials and/or designs of the attaching structures. Further, thevarious features of the embodiments disclosed herein can be used alone,or in varying combinations with each other and are not intended to belimited to the specific combination described herein. Thus, the scope ofthe claims is not to be limited by the illustrated embodiments.

1. An image sensing device, comprising: an image sensing chip having afront surface, and the front surface defining an image sensing regionthereon; an optical module, comprising: a barrel directly disposed onthe front surface and around the image sensing region; and at least atransparent element disposed in the barrel and facing to the imagesensing region; and a protecting element covering an area of the frontsurface outside the optical module and surrounding the barrel.
 2. Theimage sensing device as claimed in claim 1, wherein the protectingelement is composed of a molding compound.
 3. The image sensing deviceas claimed in claim 2, wherein the protecting element is composed of anepoxy molding compound.
 4. The image sensing device as claimed in claim2, wherein the barrel has a top surface, and the protecting elementextends to cover a portion of the top surface of the barrel.
 5. Theimage sensing device as claimed in claim 2, wherein the protectingelement extends to cover a plurality of side walls of the image sensingchip.
 6. The image sensing device as claimed in claim 1, wherein theprotecting element is a guarding ring sleeved on the barrel.
 7. Theimage sensing device as claimed in claim 6, wherein material of theprotecting element is selected from a group consisting of metal, plasticand ceramic.
 8. The image sensing device as claimed in claim 6, whereinthe barrel has a top surface, and the protecting element extends tocover a portion of the top surface of the barrel.
 9. The image sensingdevice as claimed in claim 6, wherein the protecting element is adheredto the barrel and the image sensing chip through an adhesive.
 10. Theimage sensing device as claimed in claim 1, wherein the barrel isadhered to the front surface through an adhesive.
 11. The image sensingdevice as claimed in claim 1, wherein an orthogonal projection area ofthe optical module on the front surface is less than an area of thefront surface and is more than an area of the image sensing region 12.The image sensing device as claimed in claim 1, wherein the imagesensing region comprises a plurality of light sensitive units arrangedin an array and a plurality of color filter patterns corresponding tothe light sensitive units, and the color filter patterns arerespectively disposed on the light sensitive units.
 13. The imagesensing device as claimed in claim 12, wherein the image sensing regionfurther comprises a plurality of micro lenses corresponding to the colorfilter patterns, and the micro lenses are respectively disposed on thecolor filter patterns.
 14. The image sensing device as claimed in claim12, wherein the color filter patterns comprises a plurality of redfilter patterns, a plurality of green filter patterns and a plurality ofblue filter patterns.
 15. The image sensing device as claimed in claim1, wherein the image sensing chip is a front side illumination CMOSimage sensing chip.
 16. The image sensing device as claimed in claim 1,wherein the image sensing chip is a back side illumination CMOS imagesensing chip.
 17. The image sensing device as claimed in claim 1,further comprising a substrate, wherein the image sensing chip isdisposed on a supporting surface of the substrate and is electricallyconnected to the substrate.
 18. The image sensing device as claimed inclaim 17, wherein the image sensing chip comprises a plurality ofthrough silicon vias, and the image sensing chip is electricallyconnected to the substrate through the through silicon vias.
 19. Theimage sensing device as claimed in claim 17, wherein the substratecomprises a plurality of electrically connecting portions disposed on arear surface opposite to the supporting surface.
 20. The image sensingdevice as claimed in claim 1, wherein the optical module is a lensmodule, and the transparent element includes at least a lens.